PCBA生产应注意事项论述
目　錄
一、BGA Rework 注意事項二、製程ESD / EOS 防護技術三、IC故障分析 ( Failure Analysis )四、RMA退貨處理及更換良品之注意事項
一、BGA Rework 注意事項
1.1 BGA拆封後注意事項1.2 SAT for BGA 1.3 ummary of transmission X-Ray diagnostic
   capability1.4 當BGA需要做整修 (Rework)救回程序1.5 Reflow Profile1.6 BGA (Rework)救回程序流程圖1.7 VT8633 Ball-Out Definition