WET工艺介绍
Purpose of Wet Cleaning Process
Through to a series of processes to make the wafers free from particles, organic contaminations, metal contamination, surface microroughness and native oxide using some kinds of chemicals including DIW.
Purpose of Wet Cleaning Process
For Etching process Oxide remove. Nitride remove. Photoresist & polymer remove. For Cleaning process Free of particles. Free of metal ion. Free of organic. Free of micro-roughness. Free of native oxide.