Evaluation of board-level reliability of electronic packages under consecutive d

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【作者(必填)】Chang-Lin Yeh

【文题(必填)】Evaluation of board-level reliability of electronic packages under consecutive drops
【年份(必填)】2006

【全文链接或数据库名称(选填)】https://www.researchgate.net/pub ... r_consecutive_drops

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Evaluation of board-level reliability of electronic packages under consecutive drops Chang-Lin Yeh, Yi-Shao Lai *, Chin-Li Kao Stress-Reliability Laboratory, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan Received 17 June 2005; received in revised form 16 September 2005 Available online 2 November 2005

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丘比特之吻

2020-6-20 23:16:46

Evaluation of board-level reliability of electronic
packages under consecutive drops
Chang-Lin Yeh, Yi-Shao Lai *, Chin-Li Kao
Stress-Reliability Laboratory, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone,
811 Nantze, Kaohsiung, Taiwan
Received 17 June 2005; received in revised form 16 September 2005
Available online 2 November 2005

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