标题:  Towards a halogen-free package - green molding compound
期刊:  Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International    Publication Date: 16-18 July 2003
On page(s): 107- 115

作者: Kee, J.B.N.   Yip, J.T.S.

链接：http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1225886

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