【出版时间及名称】：2010年1月亚洲科技行业研究报告
        【作者】：野村证券
        【文件格式】：pdf
        【页数】：50
        【目录或简介】：
Contents
Shortages widening 3
Channel inventory refill, the key unknown in 2010 3
Chip supply becomes an area of constraint 4
Sector-wide themes to shape 2010F OSAT landscape 6
Copper wire bonding: a game changer 7
Process issues resolved 7
Raising entry barriers: ASE at forefront, SPIL following 8
Multi-year replacement for equipment 10
Tightening supply dynamics 12
Capex rises likely for replacement and technology upgrades 12
IDM plant closures to accelerate, capacity to end up in China 12
Wafer-bumping expansion, preparing for tablet /smartbooks 14
Capex/depreciation ratios at 1x — not a sign of concern 14
Return structure improves 16
1H10F: better than seasonal, utilisations offset impact of gold 16
Sizeable changes in the past downturn 17
From power discrete to mainstream 20
China handset and power semi chips leads migration 20
Latest company views
Advanced Semicon Eng 23
ASM Pacific Technology 28
Powertech Technology 34
Siliconware Precision 40