【出版时间及名称】：2010年1月亚洲显示屏与半导体行业研究报告
        【作者】：摩根大通
        【文件格式】：pdf
        【页数】：65
        【目录或简介】：
Table of Contents
Asia Technology Upstream Team...........................................2
Key reports and major recommendation changes in 4Q09 ..3
Key likely trend in display for 2010.........................................6
TFT-LCD market outlook..........................................................7
Demand outlook...........................................................................................................7
Supply outlook.............................................................................................................7
J.P. Morgan’s global TFT-LCD model........................................................................8
Bigger ones get bigger through operation..................................................................10
LED market .............................................................................12
Touch panel market................................................................15
E-paper and 3D TV market.....................................................17
E-paper ....................................................................................17
E-paper evolution.......................................................................................................17
Technology overview.................................................................................................18
Technology 2010: Focus on flexible EPD.................................................................19
3D TV market ..........................................................................21
2010 debut for home entertainment 3D TV...............................................................21
Avatar 3D Review .....................................................................................................24
3D technology overview ............................................................................................24
Obstacles for rolling out 3D TVs in living room .......................................................25
Key trend in Semiconductor for 2010 ...................................26
Global memory market...........................................................27
DRAM market outlook ..............................................................................................28
NAND market outlook...............................................................................................32
Foundry ...................................................................................35
Worldwide semiconductor revenue forecasts ............................................................35
Impact of CapEx/Capacity increase...........................................................................35
Market share campaign: Battle filed is gradually moving from 65nm to 45nm and
TSMC maintains its dominance.................................................................................37
Tier 2 players’ dilemma .............................................................................................39
Fabless inventory analysis .........................................................................................40
Top 2 foundries: 2010 growth momentum of major customers.................................40
Top 2 foundries: Share price drivers..........................................................................41
Back-end industry ..................................................................44
IC backend growth outpaces total semiconductor and foundry....................................44
Implications of capex increase...................................................................................45
China manufacturing..................................................................................................46
Copper wirebonding ..................................................................................................46
J.P. Morgan top pick in IC backend for 2010 ............................................................47
IC design in 2010: A year of selection ..................................49
NB, TV, and WLAN to be the next main drivers ......................................................49
Key beneficiaries of the growing story ......................................................................49
J.P. Morgan top pick in IC design for 2010 ...............................................................50
Appendix .................................................................................52
Flexible EPD technologies.........................................................................................52
Amorphous silicon: A more mature process..............................................................52
Organic EPD: Science imitating nature; fighting the nature not so easy ...................53
3D TV technologies ...................................................................................................55
Active shutter glasses vs. patterned retarder ..............................................................57
Industry model assumptions ......................................................................................58
Tech Upstream Valuation Table ................................................................................61