jayachandraiah2014.Comparision of Thermal Analysis in Mobile Phone Using Ansys.pdf: https://545c.com/file/9471382-450417962

COMPARISON OF THERMAL ANALYSIS IN MOBILE PHONE
USING ANSYS
Dr. B. Jayachandraiah,
Professor of Mechanical Engineering & Vice-Principal,
Sri Kalahasteeswara Institute of Technology, Srikalahasti, Chittoor (DIst), AP
Mail ID: bjcskit2011@gmail.com
Keywords: ANSYS, comparision of Thermal Fluxes, HTC Desire c, Nokia Lumia 900, Sony Xperia
Tipo
ABSTRACT
“Necessity is the mother of invention”- one of the most important and interesting man made
inventions is mobile phone. There is a rapid increase in the number of users of mobile phone in the
last decade. Today, it's hard to find a cell phone that doesn't offer some sort of "smart" technology
because it's in such a high demand. The use of mobile phone has become an integral part of human
lives. In this paper, an attempt is made to study the optimization of 3-Dimensional heat transfer
phenomena in mobile phone using ANSYS Fluent for three different models and different
companies such as HTC Desire C, Nokia Lumia 900 and Sony Xperia Tipo. The actual dimensions
and materials are chosen for above models. The three models are modelled in Pro/E, then meshed
by 3D-10 nodded tetrahedral thermal solid elements (SOLID87) and analysed in ANSYS software,
by applying boundary conditions. The analysis is carried-out to find the nodal temperatures,
Directional Thermal Fluxes. The comparison is made for different models and by which Sony
Xperia Tipo is found to be the best from the validation with the references.